Attachment of nozzle plate to flexible circuit for facilitating

Incremental printing of symbolic information – Ink jet – Ejector mechanism

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347 87, 439 83, B41J 214

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active

054346070

ABSTRACT:
In a printhead assembly, a nozzle plate is bonded directly to special traces formed on a flexible tape automated bonding (TAB) circuit, using a commercially available automatic lead bonder, to retain the nozzle plate in place on the TAB circuit. The TAB circuit is handled in a reel-to-reel film format which is commonly used for electronic chip packaging. In a next step of the reel-to-reel process, an automatic bonder manipulates individual substrates, aligns each substrate to an associated nozzle plate, and bonds electrodes on the substrate to corresponding leads formed on the TAB circuit. In the process of the automated bonder aligning the substrate to the nozzle plate, the substrate is automatically aligned with respect to the leads on the TAB circuit. Commercially available automatic bonding equipment can be used to perform the alignment and bonding steps.

REFERENCES:
patent: 4806106 (1989-02-01), Mebane et al.
patent: 4881318 (1989-11-01), Komuro et al.
patent: 5016023 (1991-05-01), Chan et al.
patent: 5189787 (1993-03-01), Reed et al.
patent: 5237343 (1993-08-01), Osada
patent: 5278584 (1994-01-01), Keefe et al.

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