Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler
Patent
1986-11-20
1988-11-22
Godici, Nicholas P.
Metal fusion bonding
Process
Metal to nonmetal with separate metallic filler
228253, 228255, 228 563, 22826312, 219203, B23K 3102, B23K 3514
Patent
active
047859881
ABSTRACT:
A solder button may be attached to an elongated conductor by substantially surrounding a portion of the conductor with a mass of solder. The mass of solder may be crimped or heat welded into fixed position onto the elongated conductor, which is typically in ribbon form, with the solder being cut from a strip of solder by cutting and crimping means, the strip of solder being in transverse relation to the conductor at the crimping means. The elongated conductor, with attached solder buttons, may be attached by automated means in a single step to a pane of glass or the like.
REFERENCES:
patent: 2386628 (1945-10-01), Nazzewski
patent: 3333047 (1967-07-01), Geoffroi
patent: 3705047 (1972-12-01), Marriott
patent: 3978569 (1976-09-01), Cobaugh et al.
patent: 4090768 (1978-05-01), Tregoning
Garritano Mario
Topel Edward C.
Ellis Garrettson
Godici Nicholas P.
Heinrich Samuel M.
Methode Electronics Inc.
Pigott, Jr. Charles F.
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