Attachment of electronic device packages to heat sinks

Details Attachment of electronic device packages to heat sinks Attachment of electronic device packages to heat sinks

1999-01-06

1999-11-23

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361707, 361709, 361712, 361714, 361719, 257718, 257719, 257727, 174 163, 165 802, 165 803, H05K 720

Patent

active

059911549

ABSTRACT:
A heat sink having a support base which supports a base plate is used to mount one or more device packages on a circuit board or the like. The support base is adapted to be secured to the circuit board. The base plate has opposed major faces adapted for mating with device packages. Tongues or clips secure individual device packages on the major faces of the base plate independently to that device packages may be removeably attached to either or both sides of the base plate.

REFERENCES:
patent: 4544942 (1985-10-01), McCarthy
patent: 4609040 (1986-09-01), Moore

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