Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Insulative housing or support
Patent
1998-03-19
1999-08-03
Picardat, Kevin M.
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Insulative housing or support
438106, 438107, 438109, H01L 2144, H01L 2148, H01L 2150
Patent
active
059337125
ABSTRACT:
An attachment method for stacked integrated circuit (IC) chips. The method involves connecting stacked chips, such as DRAM memory chips, to each other and/or to a circuit board. Pads on the individual chips are rerouted to form pads on the side of the chip, after which the chips are stacked on top of each other whereby desired interconnections to other chips or a circuit board can be accomplished via the side-located pads. The pads on the side of a chip are connected to metal lines on a flexible plastic tape (flex) by anisotropically conductive adhesive (ACA). Metal lines on the flex are likewise connected to other pads on chips and/or to pads on a circuit board. In the case of a stack of DRAM chips, pads to corresponding address lines on the various chips may be connected to the same metal line on the flex to form an address bus. This method has the advantage of reducing the number of connections required to be made to the circuit board due to bussing; the flex can accommodate dimensional variation in the alignment of chips in the stack; bonding of the ACA is accomplished at low temperature and is otherwise simpler and less expensive than solder bonding; chips can be bonded to the ACA all at once if the sides of the chips are substantially coplanar, as in the case for stacks of identical chips, such as DRAM.
REFERENCES:
patent: 5432729 (1995-07-01), Carson et al.
patent: 5466634 (1995-11-01), Beilstein, Jr. et al.
patent: 5578516 (1996-11-01), Chou
UCRL-JC-125631, V. Malba et al., "Fabrication of a DRAM Cube Using a Novel Laser Patterned 3-D Interconnect Process," 6th International Conference On Multichip Modules, Apr. 2-4, 1997, Denver, Colorado.
Bernhardt Anthony F.
Malba Vincent
Carnahan L. E.
Collins Deven
Picardat Kevin M.
The Regents of the University of California
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