Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate
2007-05-18
2010-06-01
Zarneke, David A. (Department: 2891)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
C257SE23065
Reexamination Certificate
active
07727809
ABSTRACT:
The invention proposes a method and an apparatus for attaching a plurality of components having different arrangement densities or arrangement intervals, which can achieve shorter takt time. An object is to provide a low-cost manufacturing method of a semiconductor device and a manufacturing apparatus capable of manufacturing a semiconductor device at low cost. Plural pairs of components having different arrangement densities are simultaneously attached to each other by temporarily attaching first components to a first flexible substrate while changing an arrangement interval in an X direction, and then connecting the first components to second components over a second flexible substrate while changing an arrangement interval of the first components in a Y direction.
REFERENCES:
patent: 7141451 (2006-11-01), Tsunoda et al.
patent: 2005/0085010 (2005-04-01), Tsunoda et al.
patent: 2006/0252182 (2006-11-01), Wang et al.
patent: 2008/0042168 (2008-02-01), Watanabe et al.
patent: 1 522 956 (2005-04-01), None
patent: 2000-299598 (2000-10-01), None
patent: 2005-115646 (2005-04-01), None
Ito Kyosuke
Nakamura Osamu
Suzuki Yukie
Costellia Jeffrey L.
Nixon & Peabody LLP
Semiconductor Energy Laboratory Co,. Ltd.
Wagner Jenny L
Zarneke David A.
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