Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1995-09-15
1997-07-15
Tolin, Gerald P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
257717, 257719, 361719, H05K 720
Patent
active
056488890
DESCRIPTION:
BRIEF SUMMARY
The present invention relates to a device used for the attachment of semiconductor control and circuit elements, such as transistors, thyristors, triacs, etc., designed for the dissipation of heat loss according to the collective term of patent claim 1.
Such devices are rather conventional. They might consist of cooling elements with different designs onto which the semiconductor control and circuit elements (hereafter referred to as semiconductors) are attached by means of screws. Therefore, many semiconductors have an attachment opening in their housing or in a cooling tab protruding from the housing.
We are also familiar with devices consisting of a spring element that presses the semiconductor against the cooling element. This spring element can be attached by snapping it into suitable openings in the cooling element.
These conventional devices have characteristics that may become disadvantageous in case the height of the electronic components, which are usually mounted on a circuit board, is limited. This is often the case, since the standardization of assembly carriers, multipoint connectors and the corresponding distances in electronic components limits the lateral distances between the circuit boards to remain within a predetermined grid. Moreover, economic reasons suggest the attachment of circuit boards as closely together as possible, as is permissible for the dissipation of heat loss.
Many of the conventional devices have a tall structure that is disadvantageous for the reasons given above. If the semiconductors are to be attached to the cooling element by screws, additional insulation components will be necessary, depending on the potential position of the semiconductor housing or the cooling tab. In order to ensure the heat contact between semiconductor and cooling element at all temperatures, additional elastic elements, such as spring washers, will become necessary.
We are familiar with attachment devices in the form of springs. While these springs meet the requirements concerning ease of installation and maintaining the heat contact, they are usually designed for only one particular kind of semiconductor housing and require a relatively large amount of space on the circuit board due to their tall design.
The purpose of this invention is the development of a device for the secure attachment of semiconductors with the necessary pressure that will be low in profile and responsible for a good heat contact between semiconductor and cooling element. It will be suitable for a number of different housing designs and allow for simple mounting while meeting all the necessary insulation requirements. Moreover, the flow of force required for securing the semiconductors is not to have an effect on the circuit board.
The solution to this problem is represented in the characterizing part of patent claim 1.
The enclosed figures further illustrate the invention. They show:
FIGS. 1a, b a first design example in two views,
FIG. 1c a detail of the first design example,
FIG. 2 an additional design version of a cooling element according to this invention,
FIG. 3 a first variation of FIG. 1a, b,
FIG. 4 a second variation of FIG. 1a, b,
FIGS. 5a, b an additional design version of a device according to this invention,
FIG. 6 a second design example.
FIG. 1a is the lateral view of an attachment device according to this invention in the direction of the circuit board 1 that is shown in profile. FIG. 1b is the same device in a plan view as seen from the circuit board. A cooling element 2, resembling a T-shape in its cross-section, with a rib 14 is attached to the circuit board 1 by means of two screws 9. The cooling element 2 has two threaded openings 11 in the rib 14. The more or less rectangular base plate 6 of a spring element 15 is inserted in between the circuit board 1 and the rib 14 of the cooling element 2. This base plate has two openings 10 that are flush with the threaded openings 11. The fastening of the cooling element 2 to the circuit board 1 by means of the screws 9 will also result in a fastening of t
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patent: 3946276 (1976-03-01), Braun
patent: 4321423 (1982-03-01), Johnson
patent: 4923179 (1990-05-01), Mikolajczak
patent: 5155649 (1992-10-01), Hung
patent: 5321582 (1994-06-01), Casperson
Electronics, Kirby, Feb. 1984, pp. 149-151, "Flexible Circuits . . . Mounting".
"Movable . . . Clamp", IBM Tech Discl Bull vol. 27 #2 pp. 1140-1142, Jul. 1984.
Melcher AG
Tolin Gerald P.
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