Attachment assembly for integrated circuits

Details Attachment assembly for integrated circuits Attachment assembly for integrated circuits

1996-11-12

1999-01-05

Thompson, Gregory

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174 163, 257707, 257713, 257720, 361720, H05K 720

Patent

active

058569111

ABSTRACT:
An integrated circuit package has a top die attach area and a bottom heat spreader thermally coupled to the die for conducting heat generated by the die through a thermal interface in the main circuit board to a heat sink or heat pipe mounted underneath the main circuit board. The preferred thermal interface is a thin, thermally conductive slug mounted through an opening formed in the main circuit board. The heat spreader spans the bottom surface of the integrated circuit package substantially parallel to the main circuit board and preferably extends substantially to the inner periphery of the pin arrangement which preferably, although not exclusively, is in a ball grid array. The opening formed in the main circuit board through which the thin, thermally conductive slug is fitted, is preferably substantially flush with the bottom surface of the main circuit board and juxtaposed against the heat spreader. A thermally conductive adhesive is preferably applied to the adjoining surfaces of the heat spreader and the slug.

REFERENCES:
patent: 5285352 (1994-02-01), Pastore
patent: 5513070 (1996-04-01), Xie et al.
patent: 5541450 (1996-07-01), Jones et al.
patent: 5559675 (1996-09-01), Hsieh et al.
patent: 5583377 (1996-12-01), Higgins, III

Affiliated with

Also associated with

Rating

Attachment assembly for integrated circuits does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Attachment assembly for integrated circuits, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Attachment assembly for integrated circuits will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-866740