Surgery: light – thermal – and electrical application – Light – thermal – and electrical application – Light application
Patent
1997-08-01
1998-12-22
Kamm, William E.
Surgery: light, thermal, and electrical application
Light, thermal, and electrical application
Light application
A61N 1375
Patent
active
058512217
ABSTRACT:
An implantable medical device of the type formed of a hermetically sealed enclosure attached on a enclosure attachment surface thereof to a module attachment surface of a pre-formed header module is disclosed. The pre-formed header module is attached to the enclosure attachment surface through use of a retention structure extending away from the enclosure surface into proximity with a portion of the pre-formed header module when the enclosure and module attachment surfaces are aligned with respect to one another. The retention structure comprises a bendable member that is bent from an initial position allowing the pre-formed header module to be seated with respect to the hermetically sealed enclosure to a retention position making an attachment against a bend engaging portion of the pre-formed header module. The bendable member is the free end portion of an attachment tab having a tab base attached at a predetermined location of the hermetically sealed enclosure such that the upstanding attachment tab extends in a predetermined direction away from the enclosure surface and the free end of the attachment tab is bendable laterally with respect to the predetermined direction against the bend engaging portion. Adhesive is then applied to the retention mechanism and the space between the enclosure attachment surface and the module attachment surface.
REFERENCES:
patent: 4041956 (1977-08-01), Purdy et al.
patent: 4142532 (1979-03-01), Ware
patent: 4182345 (1980-01-01), Grose
patent: 4243042 (1981-01-01), Ware
patent: 4248237 (1981-02-01), Kenny
patent: 4314562 (1982-02-01), Ware
patent: 5070605 (1991-12-01), Daglow et al.
patent: 5086773 (1992-02-01), Ware
patent: 5207218 (1993-05-01), Carpentier et al.
patent: 5431695 (1995-07-01), Wiklund et al.
patent: 5456698 (1995-10-01), Byland et al.
patent: 5522861 (1996-06-01), Sikorski et al.
patent: 5535097 (1996-07-01), Ruben et al.
U.S. Patent Application filed on even date herewith entitled, "Attachment Apparatus and Method for an Implantable Medical Device Employing Ultrasonic Energy," to Haeg et al., p. 4, lines 24-27. (P-4590).
"Designing Parts for Ultrasonic Welding,", Branson Ultrasonics Corporation, Danbury, CT, 1975.
"TechnoLog--Today's Source for Plastics Joingin Technology," Branson Ultrasonics, Corporation, Danbury, CT, 1992.
"Ultrasonic Staking", Branson Ultrasonics Corporation, Danbury, CT, 1980.
Gonzalez Frank
Rieder Eric M.
Schulhauser Randal C.
Zart Bryan
Kamm William E.
Medtronic Inc.
Patton Harold R.
Woods Thomas F.
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