Attaching integrated circuits to printed circuit boards

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...

Reexamination Certificate

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C439S068000, C439S751000

Reexamination Certificate

active

07037115

ABSTRACT:
A land grid array socket may receive an integrated circuit package for electrical connection thereto through lands on the integrated circuit package and spring contacts which extend upwardly to engage those lands from the socket. A protector plate may be situated over the spring contacts prior to the time at which the integrated circuit package is assembled onto the socket. As a result, the spring contacts on the socket may be prevented from damage prior to the time that they are engaged by the integrated circuit package.

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patent: 6776624 (2004-08-01), Suematsu
patent: 2004/0175966 (2004-09-01), Alger et al.

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