Attaching heat sinks to printed circuit boards using...

Details Attaching heat sinks to printed circuit boards using... Attaching heat sinks to printed circuit boards using...

2007-10-23

2007-10-23

Reichard, Dean A. (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S807000, C361S709000

Reexamination Certificate

active

11089495

ABSTRACT:
An integrated circuit assembly including a heat sink, a socket, a printed circuit board and a chassis to be held together under spring bias. The assembly may be secured together with less than 2 mm spanning between a printed circuit board and a chassis.

REFERENCES:
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patent: 6055159 (2000-04-01), Sun
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patent: 6545879 (2003-04-01), Goodwin
patent: 6687129 (2004-02-01), Wilson et al.
patent: 6826054 (2004-11-01), Liu
Tran et al., U.S. Appl. No. 10/881,788, filed Jun. 30, 2004, entitled “Attaching Heat Sinks to Printed Cricuit Boards Using Preloaded Spring Assemblies”.

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