Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2003-02-03
2004-08-24
Chervinsky, Boris (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S695000, C361S697000, C361S719000, C257S718000, C257S722000, C257S727000, C174S016300, C165S080300
Reexamination Certificate
active
06781838
ABSTRACT:
TECHNICAL FIELD
The present invention generally relates to an attaching device for mounting and fixing a device for generating heat, such as a semiconductor device and a heat sink provided on the device for generating heat on a board, a mount board having the board, the device for generating heat and the heat sink, and an attaching method of the device for generating heat and the heat sink provided on the device for generating heat on the board.
BACKGROUND ART
For an electronic device such as a personal computer, a ZIF (Zero Insertion Force) socket (hereinafter “socket”), for example, is used for exchangably mounting a semiconductor device such as a CPU (Central Processing Unit) on a board.
FIG. 1
is a exploded perspective view showing a structure of a mounted board on which a related art socket is mounted.
Referring to
FIG. 1
, the mount board
1
includes a socket
2
that is mounted and fixed on a board
3
with other electronic parts. A semiconductor device
4
is mounted on the socket
2
. A heat sink
5
is provided on the semiconductor device
4
. A fan
6
is provided for the heat sink
5
. One end of a wire of a connector
7
a
for connecting an electric power source for driving the fan
6
is connected to a motor (not shown in
FIG. 1
) for driving the fan
6
. An electric power source connector
7
b
that is connected to the connector
7
a
is provided close to the socket
2
and mounted on the board
3
.
The socket
2
includes two members
2
-
1
and
2
-
2
having a thin plate rectangular parallelepiped configuration. Corresponding to the rotation of the lever
2
i
described later, the member
2
-
1
slides against the member
2
-
2
. Opening parts
2
-
1
b
and
2
-
2
b
are respectively formed in a center of main surfaces
2
-
1
a
and
2
-
2
a
of the two members
2
-
1
and
2
-
2
. A terminal
3
a
is provided on the board
3
as facing the opening parts
2
-
1
b
and
2
-
2
b
of the members
2
-
1
and
2
-
2
. A large number of first terminal receiving hole forming parts
2
-
1
c
are formed as surrounding the opening part
2
-
1
b
of the member
2
-
1
and facing each other.
Second terminal receiving hole forming parts
2
-
2
c
having larger diameters than the first terminal receiving hole forming parts
2
-
1
c
are formed at a position corresponding to the first terminal receiving hole forming parts
2
-
1
c
surrounding the opening part
2
-
1
b
of the member
2
-
1
and facing each other. Each second terminal receiving hole forming part
2
-
2
c
is connected to a contact hole forming part
3
a
that is formed at the board
3
so as to make a through hole. A wide end part of a contact
500
is provided at the second terminal receiving hole forming part
2
-
2
c
and the other end part of the contact
500
goes through the contact hole forming part
3
a.
A claw part
2
e
is provided at one side part in the X
2
direction of the member
2
-
2
of the socket
2
. Furthermore, a claw part
2
f
is provided at one side part in the X
1
direction of the socket
2
. In addition, claw parts
2
g
and
2
h
are provided at one side part in the Y
1
direction of the member
2
-
1
so as to be off set to the Z
1
-Z
2
direction and the X
1
-X
2
direction. Furthermore, the lever
2
i
is rotatably provided at an end part of one side part in then X
1
direction of the member
2
-
1
. A head end part of the lever
2
i
has a step-like configuration.
The semiconductor device
4
is a PGA (Pin Grid Array) type semiconductor device. A large number of pins
4
a
for electric power and signals are hung down from a lower part of the semiconductor device
4
in the Z
2
direction.
The fan
6
is provided at the upper part of the heat sink
5
. A large number of fins
5
a
having long lengths in the Y
1
-Y
2
direction stand at the heat sink
5
. A groove forming part
5
b
is formed so as to cross through the large number of fins
5
a
in the X
1
-X
2
direction. A metal fitting
5
c
for fixing is provided at the groove forming part
5
b
detachably or movably at least in the X
1
-X
2
direction. The metal fitting
5
c
is formed like a plate spring so as to bend in the Z
2
direction in a convex configuration. Receiving parts
5
c
-
1
and
5
c
-
2
having rectangular configurations and opening parts are formed at respective end parts of the metal fitting
5
c.
The mount board
1
having the above mentioned structure is assembled by the following steps.
First, the pin
4
a
of the semiconductor device
4
is inserted into the terminal receiving holes
2
-
1
c
and
2
-
2
c
of the socket
2
fixed at the board
3
so that the semiconductor device
4
is mounted on the socket
2
. (a mounting process of the semiconductor device)
Next, the lever
2
i
is pushed down (rotated) so that the lever
2
i
is received in a space between the claw part
2
g
and the claw part
2
h
. At this time, corresponding to the rotation of the lever
2
i
, the member
2
-
1
slides against the member
2
-
2
due to a pushing part (not shown in
FIG. 1
) formed at the end part of the lever
2
i
so as to slightly move in the X
2
direction. A head end part of the pin
4
a
pushed by the movement of the member
2
-
1
is received at the contact
500
. (a pin receiving process)
Next, the heat sink
5
where the metal fitting
5
c
is provided is mounted on the semiconductor device
4
. (a heat sink mounting process)
After that, the receiving parts
5
c
-
1
and
5
c
-
2
are bent in the Z
2
direction so that the receiving part
5
c
-
1
is received at the claw part
2
f
of the socket
2
and the receiving part
5
c
-
2
is received at the claw part
2
e
of the socket
2
. As a result of this, the heat sink
5
is fixed at the socket
2
with the semiconductor device
4
. (a heat sink fixing process) At that time, the heat sink
5
is pressed and stands close to the semiconductor device
4
by a spring force generated by the deformation of the metal fitting
5
c.
Furthermore, the connector
7
a
is connected to the electric power source connector
7
b
. (a connector connecting process)
FIG. 2
is a perspective view showing a state where the mounted board
1
shown in
FIG. 1
is assembled.
However, according to the above mentioned related art, five processes, namely the mounting process of semiconductor device, the pin receiving process, the heat sink mounting process, the heat sink fixing process, and the connector connecting process are necessary for mounting the semiconductor device
4
on the above mentioned mount board
1
. Hence, the assembling work for the mount board
1
is complicated so that the efficiency of the assembling work for the mount board
1
is low. In addition, there are the same problems as the assembling work for the mount board
1
, in a case of analyzing and maintaining work for the exchange of the semiconductor device, for example, where the processes are implemented opposite to the assembling work for the mount board
1
.
DISCLOSURE OF INVENTION
Accordingly, it is a general object of the present invention is to provide a novel and useful attaching device for mounting and fixing a device for generating heat, such as a semiconductor device, and a heat sink provided on the device for generating heat on a board, a mount board having the board, the device for generating heat and the heat sink, and an attaching method of the device for generating heat and the heat sink provided on the device for generating heat on the board, so as to make the assembling, analyzing, and maintaining work for the mount board easy and realize a high efficiency of the work.
Another and more specific object of the present invention is to provide an attaching device for mounting and fixing a device for generating heat and a heat sink provided on the device for generating heat on a board, including a base part fixed to the board, a rotation member provided to the base part rotatably, the rotation member rotated and received at the base part so that the device for generating heat is fixed to the board, and a press mechanism that presses the heat sink to the device for generating hea
Chervinsky Boris
Fujitsu Limited
Westerman Hattori Daniels & Adrian LLP
LandOfFree
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