Attaching crimped wire mesh to an object requiring heat transfer

Details Attaching crimped wire mesh to an object requiring heat transfer Attaching crimped wire mesh to an object requiring heat transfer

1992-10-16

1994-05-17

Ball, Michael W.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156153, B32B 328

Patent

active

053125088

ABSTRACT:
The disclosure describes a method of attachment of a corrugated wire mesh having a plurality of wire bends to a substrate. In the method, flats are formed at the bends, and the flats are lightly coated with a thermosetting adhesive. And in a subsequent clamping operation, the adhesive is displaced from the interface of contact between the wire and substrate, thereby displacing the adhesive to the adjacent interstices. This leaves the mesh and substrate in direct thermal contact without a distinct layer of adhesive separating them.

REFERENCES:
"Adhesivers Handbook", Shields, J., CRC Press, 1970, pp. 235-237.

Affiliated with

Also associated with

Rating

Attaching crimped wire mesh to an object requiring heat transfer does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Attaching crimped wire mesh to an object requiring heat transfer, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Attaching crimped wire mesh to an object requiring heat transfer will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-874257