Compositions – Electrically conductive or emissive compositions – Elemental carbon containing
Reexamination Certificate
2002-01-02
2004-11-16
Gupta, Yogendra N. (Department: 1751)
Compositions
Electrically conductive or emissive compositions
Elemental carbon containing
C252S518100, C252S513000, C252S06290R, C257S746000, C257S040000, C428S3550EN, C438S610000, C438S119000, C427S550000, C427S598000, C501S010000, C420S008000
Reexamination Certificate
active
06818155
ABSTRACT:
BACKGROUND
The present invention relates to circuit components and, in particular, to attaching components to underlying substrates.
BACKGROUND OF THE RELATED ART
There may be several techniques for attaching components, such as an integrated circuit, to underlying substrates, such as printed circuit cards. However, these techniques may have multiple problems. For example, eutectic lead solder may be used to attach a component to an underlying substrate because the eutectic lead solder has a low melting temperature and good viscosity, but environmental regulations may force lead solders to be phased out of manufacturing. Other solders that do not contain lead, including, but not limited to, tin alloys, may be used to connect components to underlying substrates. However, these solders have high melting temperatures that may damage the components or underlying substrates during the process of attaching them together. Other methods of attaching components and underlying substrates, such as cup and cone suspension, may have contact resistance problems between the surfaces of the component and the underlying substrate.
REFERENCES:
patent: 5545367 (1996-08-01), Bae et al.
patent: 5773322 (1998-06-01), Weld
patent: 6011307 (2000-01-01), Jiang et al.
patent: 6555762 (2003-04-01), Appelt et al.
patent: 01-052303 (1989-02-01), None
patent: 09-023049 (1997-01-01), None
“Process for producing Magnetic Layers” IBM Technical Disclosure Bulletin # NN86123197, Dec. 1986, US.
Armendariz Norman J.
Dishongh Terrance J.
Hsieh George
Spaulding David V.
Blakely , Sokoloff, Taylor & Zafman LLP
Gupta Yogendra N.
Intel Corporation
Vijayakumar Kallambella
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