Attaching components and reworking circuit boards

Metal fusion bonding – Process – Plural joints

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Details

228 62, 228 55, 228264, B23K 1018, B23K 304, H01L 2158

Patent

active

056390114

ABSTRACT:
In one aspect, a device for attaching a component to a circuit board is provided, comprising a circuit board held in a holder and a contact heater that heats the component on the circuit board by contact and by conducting heat through the component. In a further aspect, the contact heater is in a wand which is manually moved onto the component. In another aspect, the invention provides a method for attaching a component to a circuit board, comprising the steps of gripping the component with a contact heater; placing the component on the circuit board; and heating the component on the circuit board by contact, wherein heat conducted through the component melts solder under the component and attaches the component to the circuit board.

REFERENCES:
patent: 3632973 (1972-01-01), O'Keefe
patent: 3699306 (1972-10-01), Finch
patent: 4518110 (1985-05-01), Breske et al.
patent: 4528746 (1985-07-01), Yoshimura
patent: 4696096 (1987-09-01), Green et al.
patent: 4799617 (1989-01-01), Friedman
patent: 4967950 (1990-11-01), Legg et al.
patent: 5048742 (1991-09-01), Fortune

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