Atraumatic sensor lead assemblies

Surgery: light – thermal – and electrical application – Light – thermal – and electrical application – Electrical energy applicator

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C607S116000, C600S365000

Reexamination Certificate

active

10918060

ABSTRACT:
The invention is directed to lead configurations for sensors that allow for less invasive sensor replacement procedures. In one configuration, a sensor lead assembly includes an outer lead body and an inner lead including a sensor such as an electrochemical glucose sensor. The inner lead can be positioned in an inner conduit of the outer lead body. The outer lead body may be substantially permanently implanted in the patient, and the inner lead can be implanted through the inner conduit of the outer lead body. Once the sensor of the inner lead has worn out or otherwise exhausted its useful life, the inner lead can be removed, and a new inner lead can be implanted in place of the old inner lead.

REFERENCES:
patent: 4403984 (1983-09-01), Ash et al.
patent: 5651767 (1997-07-01), Schulman et al.
patent: 5824030 (1998-10-01), Yang et al.
patent: 5985129 (1999-11-01), Gough et al.
patent: 6328699 (2001-12-01), Eigler et al.
patent: 2002/0128546 (2002-09-01), Silver

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Atraumatic sensor lead assemblies does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Atraumatic sensor lead assemblies, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Atraumatic sensor lead assemblies will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3845514

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.