Coating apparatus – Gas or vapor deposition – Multizone chamber
Reexamination Certificate
2007-02-12
2011-10-25
Moore, Karla (Department: 1716)
Coating apparatus
Gas or vapor deposition
Multizone chamber
C427S255500
Reexamination Certificate
active
08043432
ABSTRACT:
Systems and methods for depositing thin films using Atomic Layer Deposition (ALD). The deposition system includes a process chamber with a peripheral sidewall, partitions that divide a processing space inside the process chamber into at least first and second compartments, and a platter that supports substrates within the processing space. The platter rotates the substrates relative to the stationary peripheral sidewall and compartments. The first compartment receives a process material used to deposit a layer on each of the substrates. An injector, which injects the process material, communicates with the first compartment through the peripheral sidewall.
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Moore Karla
Tokyo Electron Limited
Wood Herron & Evans LLP
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