Atmospheric pressure, elevated temperature gas desorption appara

Gas separation – With nonliquid cleaning means for separating media – Solid agent cleaning member movingly contacts apparatus

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Details

55270, 96141, 96144, B01D 5304, B01D 3518

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active

054825245

ABSTRACT:
An atmospheric pressure, elevated temperature gas desorption apparatus which enables quanitiative analysis of impurities absorbed in or on the surface of a solid sample (semiconductor wafer, optical disc, etc.) is disclosed. The atmospheric pressure, elevated temperature gas desorption apparatus for desorbing impurities absorbed in or on the surface of a plate-like solid sample 18 into a carrier gas 19 in a chamber 6 under an atmospheric pressure while increasing the temperature of the solid sample 18 includes a desorption room 7A provided in the chamber 6 and connected through to a first gas supply system 1 for supplying the carrier gas 19, for desorbing impurities absorbed in or on the surface of the solid sample 18 into the carrier gas 19. A sample support room 7B is provided in the chamber 6 and is separated from the desorption room 7A by a partition member 6A. The solid sample 18 is in close contact with the partition member 6A. A heater 8 for heating the solid sample 18 is in close contact with the partition member 6A. A reserve room 9 is connected to the sample support room 7B and to a second gas supply system 13 for supplying a purge gas.

REFERENCES:
patent: 4321822 (1982-03-01), Marple et al.
patent: 4650499 (1987-03-01), Scott
patent: 4725294 (1988-02-01), Berger
"Out Gas Free Resist Process", VLSI Ultra-Clean Technology Workshop. No. 5, Ultra-Clean Resist Processing, Jun. 28, 1990.

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