Atmospheric pressure CVD apparatus

Details Atmospheric pressure CVD apparatus Atmospheric pressure CVD apparatus

1996-04-23

1997-05-06

Bueker, Richard

Coating apparatus

Gas or vapor deposition

Multizone chamber

118725, 118729, 156345, C23C 1600

Patent

active

056266774

ABSTRACT:
An atmospheric pressure CVD apparatus includes an upper convey mechanism, a lower convey mechanism, a loader susceptor up mechanism, and a loader susceptor down mechanism. The upper convey mechanism horizontally conveys a susceptor to be mounted with a semiconductor wafer, and has a wafer loader mechanism, an upper rail, an upper susceptor driving portion, a heater, a dispersion head, and a wafer unloader mechanism. The lower convey mechanism is arranged below the upper convey mechanism to horizontally convey the susceptor, and has a first lower rail, a first lower susceptor driving portion, a plasma reaction portion, a second lower rail, and a second lower susceptor driving portion. The loader susceptor up mechanism moves up and conveys the susceptor from the lower convey mechanism to the upper convey mechanism. The loader susceptor down mechanism moves down and conveys the susceptor from the upper convey mechanism to the lower convey mechanism.

REFERENCES:
M. Yoshida, et al., "Edge Eliminated Head", IEEE Transactions on Magnetics, vol. 29, No. 6, Nov. 1993, pp. 3837 - 3839.

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