Atmosphere controlled soldering apparatus with incorporated sold

Details Atmosphere controlled soldering apparatus with incorporated sold Atmosphere controlled soldering apparatus with incorporated sold

1994-02-22

1995-08-08

Rosenbaum, Mark

Metal fusion bonding

Including means to apply flux or filler to work or applicator

By partial or total immersion of work or applicator into liquid

B23K 100

Patent

active

054391580

ABSTRACT:
An improved wave soldering apparatus that protects the molten solder and the components being soldered from exposure to ambient air while the solder is in a liquid condition. At the soldering station, which is enclosed in a controlled atmosphere chamber, all the liquid solder, pumps and other elements exposed to liquid solder are enclosed within the chamber. This eliminates the formation of dross which interferes with the soldering process and also with the operation of the solder pumps. The inlet and outlet paths from the chamber, through which the components pass, are extended both to exclude ambient air and to permit the components to cool in a controlled atmosphere.

REFERENCES:
patent: 4616775 (1986-10-01), Simonetti
patent: 5148961 (1992-09-01), Humbert et al.
patent: 5203489 (1993-04-01), Gileta et al.
patent: 5232562 (1993-08-01), Elliott
patent: 5294036 (1994-03-01), Den Dopper
patent: 5320274 (1994-06-01), Precious et al.

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