Asymmetrical scribe and separation method of manufacturing liqui

Liquid crystal cells – elements and systems – Nominal manufacturing methods or post manufacturing...

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G02F 113

Patent

active

059632895

ABSTRACT:
A method of manufacturing liquid crystal on silicon devices uses asymmetric placement of scribes on silicon and glass substrate layers to maximize the yield of processed active matrix silicon wafers. Asymmetrical scribing minimizes a dimension from a gasket seal between the substrates to a lower bond pad edge. An opposite glass overhang provides an interconnect redundancy for an ITO plate or a repair site for electrical contact to the ITO plate. Methods of device separation employing partial sawing are also employed.

REFERENCES:
patent: 5832601 (1998-11-01), Eldridge et al.

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