Asymetric layout structures for transistors and methods of...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Junction field effect transistor

Reexamination Certificate

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C257S401000, C257S773000, C438S179000, C438S286000

Reexamination Certificate

active

10977227

ABSTRACT:
High power transistors are provided. The transistors include a source region, a drain region and a gate contact. The gate contact is positioned between the source region and the drain region. First and second ohmic contacts are provided on the source and drain regions, respectively. The first and second ohmic contacts respectively define a source contact and a drain contact. The source contact and the drain contact have respective first and second widths. The first and second widths are different. Related methods of fabricating transistors are also provided.

REFERENCES:
patent: 3903592 (1975-09-01), Heckl
patent: 4732871 (1988-03-01), Buchmann et al.
patent: 4737469 (1988-04-01), Stevens
patent: 4757028 (1988-07-01), Kondoh et al.
patent: 4762806 (1988-08-01), Suzuki et al.
patent: 4803526 (1989-02-01), Terada et al.
patent: 4897710 (1990-01-01), Suzuki et al.
patent: 4947218 (1990-08-01), Edmond et al.
patent: 5121174 (1992-06-01), Forgerson et al.
patent: 5229625 (1993-07-01), Suzuki et al.
patent: 5264713 (1993-11-01), Palmour
patent: 5270554 (1993-12-01), Palmour
patent: 5289015 (1994-02-01), Chirovsky et al.
patent: 5300795 (1994-04-01), Saunier et al.
patent: 5306650 (1994-04-01), O'Mara, Jr. et al.
patent: 5396085 (1995-03-01), Baliga
patent: 5399883 (1995-03-01), Baliga
patent: 5482875 (1996-01-01), Vaitkus et al.
patent: 5510630 (1996-04-01), Agarwal et al.
patent: 5686737 (1997-11-01), Allen
patent: 5719409 (1998-02-01), Singh et al.
patent: 5742082 (1998-04-01), Tehrani et al.
patent: 5869856 (1999-02-01), Kasahara
patent: 5891769 (1999-04-01), Liaw et al.
patent: 5895939 (1999-04-01), Ueno
patent: 5900648 (1999-05-01), Harris et al.
patent: 5925895 (1999-07-01), Sriram et al.
patent: 5972801 (1999-10-01), Lipkin et al.
patent: 6107649 (2000-08-01), Zhao
patent: 6121633 (2000-09-01), Singh et al.
patent: 6218680 (2001-04-01), Carter, Jr. et al.
patent: 6316793 (2001-11-01), Sheppard et al.
patent: 6670687 (2003-12-01), Satoh et al.
patent: 6686616 (2004-02-01), Allen et al.
patent: 2003/0017660 (2003-01-01), Li
patent: 2003/0075719 (2003-04-01), Sriram
patent: 19900169 (1999-07-01), None
patent: 0 081 396 (1983-06-01), None
patent: 0518 683 (1992-12-01), None
patent: 1 306 905 (2003-05-01), None
patent: 47-5124 (1972-03-01), None
patent: 54-155482 (1979-10-01), None
patent: 59134874 (1984-08-01), None
patent: 60-142568 (1985-07-01), None
patent: 60-154674 (1985-08-01), None
patent: 60-189250 (1985-09-01), None
patent: 63-47983 (1988-02-01), None
patent: 64-59961 (1989-03-01), None
patent: 1-106476 (1989-04-01), None
patent: 1-106477 (1989-04-01), None
patent: 1-196873 (1989-08-01), None
patent: 1-308876 (1989-12-01), None
patent: 2-10772 (1990-01-01), None
patent: 4-4225534 (1992-08-01), None
patent: 9-36359 (1997-02-01), None
patent: 11-150124 (1999-06-01), None
patent: WO98/19342 (1998-05-01), None
patent: WO 98/49732 (1998-11-01), None
patent: WO98/49732 (1998-11-01), None
patent: WO 01/67521 (2001-09-01), None
patent: WO 01/86727 (2001-11-01), None
A 10 W 2 GHz Silicon Carbide MESFET, Microwave Journal, Sep. 1999, pp. 232, 240, 242.
Allen,Silicon Carbide MESFET's with 2W/mm and 50% P.A.E. at 1.8 GHz, 1996, Dec. 1996.
Browne, Editorial:The Power and the Glory, Microwaves & RF, Jul. 1999, p. 17.
Browne,SiC MESFET Delivers 10-W Power at 2GHZ, Microwaves & RF, Oct. 1999, pp. 138-139.
Browne,Top Products of 1999, Microwaves &RF, Dec. 1999, pp. 223-233.
Carter et al.,Silicon Carbide and Related Materials, 1999, Part 2, Materials Science Forum, vols. 338-342, pp. 1247-1266 (2000), Dec. 2000.
Evwaraye et al., “Examination of Electrical and Optical Properties of Vanadium in Bulk n-Type Silicon Carbide,”J. Appl. Phys.vol. 76, No. 10, 1994, Nov. 1994.
First Silicon Carbide Microwave Power Products Are Introduced, Applied Microwave & Wireless, pp. 104, Dec. 2000.
Heftman,Wireless Semi Technology Heads Into New Territory, Microwaves & RF, Feb. 2000, pp. 31-38.
Hilton et al.,Suppression of Instabilities in 4H-SiC Microwave MESFETs, 2000 8thIEEE International Symposium, Dec. 2000.
Hilton et al.,Surface Induced Instabilities in 4H-SiC Microwave MESFETs, Materials Science Forum, vols. 338-342, 2000, pp. 1251-1254, Dec. 2000.
Jonsson et al.,Physical Simulations on the Operations of 4H-SiC Microwave Power Transistors, Materials Science Forum, vols. 338-342, 2000, pp. 1263-1266, Dec. 2000.
Kelner et al.,β-SiC MESFET's and Buried-Gate JFET's, IEEE Electron Device Letters, vol. EDL-8, No. 9, Sep. 1987, pp. 428-430.
Kong et al.,Temperature Dependence of the Current-Voltage Characteristics of Metal-Semiconductor Field-Effect Transistors in n-Type β -SiC Grown Via Chemical Vapor Deposition, Appl. Phys Lett., vol. 51, No. 6, Aug. 10, 1987, pp. 442-444.
Konstantinov et al., High Performance Silicon Carbide MESFET Utilizing Lateral Epitaxy,Materials Science Forum, vols. 389-393, pp. 1375-1378, Dec. 2002.
Konstantinov et al.,Investigation of Lo-Hi-Lo and Delta-Doped Silicon Carbide Structures, Mat. Res. Soc. Symp. Proc., vol. 640, 2001, pp. H2.4.1-H2.4.6, Dec. 2001.
Ma, et al.,High Efficiency LDMOS Power FET for Low Voltage Wireless Communications, 1996 IEEE, Dec. 1996.
Nilsson et al.,Characterization of SiC MESFETs on Conducting Substrates, Materials Science Forum, vols. 338-342, 2000, pp. 1255-1258, Dec. 2000.
Noblanc et al.,Power Density Comparison Between Microwave Power MESFET's Processed on Conductive and Semi-Insulating Wafer, Materials Science Forum, vols. 338-342, 2000, pp. 1247-1250, Dec. 2000.
Palmour et al.,Characterization of Device Parameters in High-Temperature Metal-Oxide-Semiconductor Field Effect Transistors in β -SiC Thin Films, J. Appl. Phys, vol. 64, No. 4, Aug. 15, 1988, pp. 2168-2177.
Palmour et al.,High-Temperature Depletion-Mode Metal-Oxide-Semiconductor Field Effect Transistors in Beta-SiC Thin Films, Appl. Phys. Lett., vol. 51, No. 24, Dec. 14, 1987, pp. 2028-2030.
Palmour et al.,Ultrafast Silicon-Carbide Rectifiers, Powertechnics Magazine, Aug. 1989, pp. 18-21.
Rorsman et al.,Fabrication, Characterization and Modeling of SiC MESFETs, Materials Science Forum, vols. 338-342, 2000, pp. 12-59-1262, Dec. 2000.
SiC MESFET Drives PCS Base Stations, Wireless Systems Design, Oct. 1999, pp. 24.
Soares, ed.,GaAs MESFET Circuit Design, Artech House, 1988, pp. 7-9, 17-18, Dec. 1988.
Sze,Physics of Semiconductor Devices, Second Edition, John Wiley & Sons, 1981, pp. 341-347, Dec. 1981.
Yokogawa et al.,Electronic Properties of Nitrogen Delta-Doped Silicon Carbide Layers, Mat. Res. Soc. Symp. Proc., vol. 640, 2001, pp. H2.5.1-H2.5.6, Jun. 2001.
Invitation to Pay Additional Fees, Annex to Form PCT/ISA/206—Communication Relating to the Results of the Partial International Search, corresponding to International Application No. PCT/US2005/030254, mailed Dec. 4, 2006.
International Search Report and Written Opinion of the International Searching Authority, corresponding to International Application No. PCT/US2005/030254, mailed Jan. 30, 2007.

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