Assembly with a printed circuit board

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Reexamination Certificate

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08059418

ABSTRACT:
An assembly (10) comprises a housing (11) and a printed circuit board (14) received in the housing. The housing includes a housing body (12) and a cover (16). The housing body (12) has a first surface (26) supporting the printed circuit board (14) and also has a portion defining a second surface (22) receiving the cover (16). At least the portion of the housing body is formed of a material that is meltable by a laser welder. The second surface (22) is spaced from the first surface (26) by a distance that is at least as great as a thickness of the printed circuit board (14). The printed circuit board (14) is at least partially held in place by melted material from said portion.

REFERENCES:
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patent: 6552911 (2003-04-01), Haupt et al.
patent: 6754085 (2004-06-01), Kalkbrenner
patent: 6850418 (2005-02-01), Dutton et al.
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patent: 7394661 (2008-07-01), Wang et al.
patent: 7433196 (2008-10-01), Wang et al.
patent: 7508682 (2009-03-01), Badarinarayan et al.
patent: 2002/0024800 (2002-02-01), Skofljanec
patent: 2003/0063444 (2003-04-01), Kalkbrenner
patent: 2004/0057217 (2004-03-01), Dutton et al.
patent: 2007/0064403 (2007-03-01), Badarinarayan et al.
patent: 2007/0227866 (2007-10-01), Dimig
patent: 2008/0165517 (2008-07-01), Wang et al.

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