Assembly using electrically conductive cement

Stock material or miscellaneous articles – Web or sheet containing structurally defined element or... – Including a second component containing structurally defined...

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

428209, 428901, B32B 900

Patent

active

053266366

ABSTRACT:
An electrically conductive cement having substantially stable conductivity and resistance characteristics under high humidity conditions comprises a mixture of two epoxy resins with the proportion of each epoxy resin adjusted to provide a volumetric shrinkage in the mixture in the 4 to 16% and a conductive silver particular filler including agglomerates having size and surface characteristics that maintain stable electrical contact with an electrical component lead. The epoxy mixture is preferably a combination of a high-shrinkage epoxy resin and a lower-shrinkage epoxy resin in the appropriate amounts of each so as to produce the desired volumetric shrinkage characteristic. The conductive particle filler is preferably an admixture of silver flakes, silver powder, and an effective amount of silver agglomerates. The agglomerates are irregularly shaped particles having multiple surface indentations and recesses to produce many rough-edged salients or ridges and having a particle length, width, and thickness aspect ratio of about 1:1:1. An effective amount of such agglomerates appears to effect penetration of surface oxides when establishing the cemented connection as a result of the volumetric shringage of the polymeric carrier upon curing.

REFERENCES:
patent: 3140342 (1964-07-01), Ehrreich et al.
patent: 3663241 (1972-05-01), Short
patent: 3750243 (1973-08-01), Prentice
patent: 3762946 (1973-10-01), Stow et al.
patent: 3968056 (1976-07-01), Bolon et al.
patent: 4088801 (1978-05-01), Bolon et al.
patent: 4113981 (1978-09-01), Fujita et al.
patent: 4210704 (1980-07-01), Chandross et al.
patent: 4243474 (1981-01-01), Shirai et al.
patent: 4410457 (1983-10-01), Fujimura et al.
patent: 4487811 (1984-12-01), Eichelberger et al.
patent: 4564563 (1986-01-01), Martin et al.
patent: 4566990 (1986-01-01), Liu et al.
patent: 4568592 (1986-04-01), Kawaguchi et al.
patent: 4595606 (1986-06-01), St. John et al.
patent: 4624801 (1986-11-01), Kawaguchi et al.
patent: 4696764 (1987-09-01), Yamazaki
patent: 4701279 (1987-10-01), Kawaguchi et al.
patent: 4716081 (1987-12-01), Ehrreich
patent: 4729809 (1988-03-01), Dery et al.
patent: 4732702 (1988-03-01), Yamazaki et al.
patent: 4747968 (1988-05-01), Gilleo
patent: 4793946 (1988-12-01), Hsu
patent: 4814040 (1989-03-01), Ozawa
patent: 4836955 (1989-06-01), Ehrreich
patent: 4859268 (1989-08-01), Joseph et al.
patent: 4859364 (1989-08-01), Yamamoto et al.
patent: 4880570 (1989-11-01), Sanborn et al.
patent: 4975221 (1990-12-01), Chen et al.
patent: 4976813 (1990-12-01), Salensky et al.
patent: 5006575 (1991-04-01), Chan
patent: 5045141 (1991-09-01), Salensky et al.
patent: 5087314 (1992-02-01), Sandborn et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Assembly using electrically conductive cement does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Assembly using electrically conductive cement, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Assembly using electrically conductive cement will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-795365

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.