Stock material or miscellaneous articles – Layer or component removable to expose adhesive
Reexamination Certificate
2005-08-02
2005-08-02
Pyon, Harold (Department: 1772)
Stock material or miscellaneous articles
Layer or component removable to expose adhesive
C438S118000, C438S464000, C524S503000
Reexamination Certificate
active
06924016
ABSTRACT:
Disclosed is an assembly system for stationing a semiconductor wafer suitable for processing said wafer, said system comprising: (a) a holding block; (b) a semiconductor wafer; and (c) an aqueous adhesive composition interposed between the holding block and the semiconductor wafer. Also disclosed is a process for manufacturing a semiconductor wafer, comprising the steps of: (a) providing a holding block; (b) providing a semiconductor wafer; (c) coating either the holding block or one side of the semiconductor wafer with the foregoing aqueous adhesive composition; (d) contacting either one side of the semiconductor wafer to the coated holding block or the coated side of the semiconductor wafer to the holding block, such that the semiconductor wafer adheres to the coated holding block; (e) polishing the other side of the semiconductor wafer; and (f) removing the semiconductor wafer from the coated holding block.
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Plass Robert R.
Wanat Stanely F.
AZ Electronic Materials USA Corp.
Kass Alan P.
Nordmeyer Patricia L.
Pyon Harold
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