Assembly system for microcomponent devices such as semiconductor

Details Assembly system for microcomponent devices such as semiconductor Assembly system for microcomponent devices such as semiconductor

1977-09-01

1979-09-04

Lanham, C. W.

Metal fusion bonding

With means to juxtapose and bond plural workpieces

With means to treat workpieces

228 6A, 228 13, 228 151, 29741, H01L 2198

Patent

active

041665627

ABSTRACT:
An assembly system for assembling microcomponents of semi-conductor or other electronic devices includes on a unitary machine frame the tooling for precision excising tape mounted microcomponents, precision forming their electrical leads, placement of the components in correct registration with conductors on a pre-positioned substrate, and bonding the formed leads to the conductors.

REFERENCES:
patent: 3442432 (1969-05-01), Santangini
patent: 3465408 (1969-09-01), Clark et al.
patent: 3593404 (1971-07-01), Ragard
patent: 3689991 (1972-09-01), Aird
patent: 3724068 (1973-04-01), Galli
patent: 3859718 (1975-01-01), Noe
patent: 3887783 (1975-06-01), Comette
patent: 3911568 (1975-10-01), Hartlerroad et al.
patent: 3949925 (1976-04-01), Keizer et al.
patent: 4003125 (1977-01-01), Wallick
patent: 4010885 (1977-03-01), Keizer et al.
Grossman, "Film-Carrier Technique . . ." Electronics, May 16, 1974.

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