Assembly structure for electronic power integrated circuit...

Details Assembly structure for electronic power integrated circuit... Assembly structure for electronic power integrated circuit...

2003-02-18

2008-12-02

Andújar, Leonardo (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257S675000, C257S672000

Reexamination Certificate

active

07459771

ABSTRACT:
An assembly structure for an electronic integrated power circuit, which circuit is fabricated on a semiconductor die having a plurality of contact pads associated with said integrated circuit and connected electrically to respective leads of said structure, wherein a shield element is coupled thermally to said die by a layer of an adhesive material.

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