Assembly structure for an optical integrated circuit device

Details Assembly structure for an optical integrated circuit device Assembly structure for an optical integrated circuit device

1994-08-01

1996-01-30

Healy, Brian

Optical waveguides

Integrated optical circuit

385 49, 385130, 385131, 372 43, 372 50, G02B 612

Patent

active

054886783

ABSTRACT:
In an assembly structure of an optical integrated circuit device for assembling a semiconductor laser device and an optical integrated circuit substrate, the semiconductor laser device includes a recessed/raised structure. On the other hand, the optical integrated circuit substrate includes another recessed/raised structure to fit the recessed/raised structure of the semiconductor laser device. These recessed/raised structures are formed so that their cross sections taken parallel to the layers forming the semiconductor laser device are symmetric in shape about the respective optical axes of the semiconductor laser device and the optical integrated circuit substrate. Further, the recessed/raised structures preferably contain a tapered portion as part of its contour, the taper forming a prescribed angle with the respective optical axes. Thus, the mounting accuracy required to achieve the prescribed coupling efficiency in the optical integrated circuit device can be obtained by simple mechanical operations.

REFERENCES:
patent: 5159700 (1992-10-01), Reid et al.

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