Registers – Records – Conductive
Patent
1997-05-08
1999-07-13
Lee, Michael G.
Registers
Records
Conductive
235486, 235495, 902 26, 361737, G06K 1906
Patent
active
059230266
ABSTRACT:
Upper and lower exterior members are coupled together without using ultrasonic welding process. Upper and lower metal panels are brought into electrical conduction therebetween with simple construction. In an IC card having an assembly structure wherein an upper exterior member is formed by integrating an upper frame with an upper metal panel, while a lower exterior member is formed by integrating a lower frame with a lower metal panel; and wherein an electric circuit board with specified electronic components incorporated therein and a connector to be connected to the electric circuit board are provided, in which the arrangement of the upper exterior member and the lower exterior member are coupled with each other, by which the IC card is assembled. The IC card upper metal panel and the lower metal panel are partly exposed at coupling portions of the upper exterior member and the lower exterior member with each other, respectively, and a claw portion is provided at an exposed portion of either one of the upper and lower metal panels, while an engaging hole is provided at an exposed portion of the other metal panel, wherein the claw portion is engaged with the engaging hole so that the upper exterior member and the lower exterior member are coupled with each other.
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Lee Michael G.
Mitsubishi Denki & Kabushiki Kaisha
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