Assembly structure for a connector

Electrical connectors – Electromagnetic or electrostatic shield – Shielding individually surrounding or interposed between...

Reexamination Certificate

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Details

C439S607560

Reexamination Certificate

active

07052321

ABSTRACT:
The present invention is related to an assembly structure for a high frequency connector, which is mainly formed by two interior connectors stacked, wherein each connector is connected between the transmission conductive paths of a printed circuit board and separated to form a conductive shielding layer, wherein the printed circuit board comprises at least four layers, the top and bottom surface, two connectors and a controller form a first transmission path and a second transmission path, and forms a grounding layer in an intermediate layer of the printed circuit board to shield the first transmission path and the second transmission path, thereby preventing the interference from when two connectors simultaneously transmit high frequency signal so that makes the layout of the circuit more easier and can improve the high frequency impedance and its relative variables.

REFERENCES:
patent: 6139367 (2000-10-01), Yeh
patent: 6165014 (2000-12-01), Kao et al.
patent: 6364707 (2002-04-01), Wang
patent: 6837720 (2005-01-01), Hicks et al.
patent: 6840817 (2005-01-01), Chen
patent: 2001/0049227 (2001-12-01), Zhu et al.

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