Assembly structure

Details Assembly structure Assembly structure

2008-05-22

2010-06-29

Lam, Cathy (Department: 1794)

Electricity: conductors and insulators

Conduits, cables or conductors

Combined

C174S255000, C174S261000, C174S07400A, C361S772000, C361S774000

Reexamination Certificate

active

07745726

ABSTRACT:
An assembly structure is provided. The assembly structure includes a first substrate, a second substrate and a medium layer disposed between the first and second substrates. The medium layer includes a side edge, and the second substrate includes at least one lead wire. When the second substrate is disposed on the medium layer, the lead wire of the second substrate is relatively oblique to the side edge of the medium layer.

REFERENCES:
patent: 3499098 (1970-03-01), Mcgahey et al.
patent: 3678437 (1972-07-01), Vaden
patent: 4426548 (1984-01-01), Oritsuki et al.
patent: 5484648 (1996-01-01), Odashima et al.
patent: 5672400 (1997-09-01), Hansen et al.
patent: 5965064 (1999-10-01), Yamada et al.
patent: 6564450 (2003-05-01), Engbring et al.
patent: 6596947 (2003-07-01), Kurita et al.
patent: 6636000 (2003-10-01), Asami et al.
patent: 6884833 (2005-04-01), Chheang et al.

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