Assembly procedure for two structures and apparatus produced by

Details Assembly procedure for two structures and apparatus produced by Assembly procedure for two structures and apparatus produced by

1997-07-16

1999-11-09

Chaudhari, Chandra

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

36446802, 36446821, H01L 2120

Patent

active

059813601

ABSTRACT:
This invention relates to a procedure for assembling two structures (2, 4) comprising:

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patent: 5812232 (1998-09-01), Shiroto et al.
patent: 5821762 (1998-10-01), Hamaguchi et al.
patent: 5831238 (1998-11-01), Takuya et al.
patent: 5847438 (1998-12-01), Kikuchi et al.

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