Assembly packaging using induction heating

Details Assembly packaging using induction heating Assembly packaging using induction heating

2007-01-09

2007-01-09

Leung, Philip H. (Department: 3742)

Electric heating

Inductive heating

Metal working

C219S605000, C219S656000, C219S635000, C228S179100

Reexamination Certificate

active

10876512

ABSTRACT:
An embodiment of the present invention is a technique to package a device. Heat is localized on a die having bumps on a package substrate using a first induction heater operating at a first frequency. Heat is localized on at least an integrated heat spreader (IHS), a thermal interface material (TIM), an underfill, and a sealant on the die using a second induction heater operating at a second frequency.

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patent: 2004/0060688 (2004-04-01), Delano
“Theory of Heating by Induction”, Chapter 2, pp. 5-18, http://www.asminternational.org/pdf/spotlights/609—ch02—web.pdf.

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