Electricity: electrical systems and devices – Safety and protection of systems and devices – With specific current responsive fault sensor
Patent
1988-08-09
1991-06-18
Tarcza, Thomas H.
Electricity: electrical systems and devices
Safety and protection of systems and devices
With specific current responsive fault sensor
361392, 361395, 361414, 361417, H01L 2510
Patent
active
050253069
ABSTRACT:
A three dimensional package having at least one semiconductor chip having input/output conductive pads along its periphery includes a dielectric carrier over at least a portion of the chip and a plurality of conductors mounted on the carrier between the chip and the dielectric carrier. The plurality of conductors are mounted within the periphery of the chip with one end connected to the conductive pads and with the other end of the plurality of conductors exiting from the same side of the chip. The plurality of conductors exiting from the same side are electrically coupled to an interconnect substrate.
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Jarvela et al., "Stacked High-Density Multichip Module", IBM Technical Disclosure Bulletin, (vol. 14, No. 10; 3/72; pp. 2896-2897).
Drumm James M.
Johnson Randall E.
Gregory Bernarr Earl
Honeycutt Gary C.
Merrett N. Rhys
Sharp Melvin
Tarcza Thomas H.
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