Assembly of power circuits and numerical data printed on a...

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

Reexamination Certificate

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Details

C174S261000, C174S262000, C361S760000, C361S763000, C361S794000

Reexamination Certificate

active

06797889

ABSTRACT:

BACKGROUND
The invention concerns printed circuit boards. Various parameters can distinguish the boards from one another, such as, for example, the thickness of the printed circuit, which becomes larger as the power of the components incorporated in the circuit is large or, conversely, it is thinner when the intensity of the currents circulating in it is low, and the density of the components at the surface of the circuit can be an inverse function of the thickness of the circuit etched on the board. We speak of etching class to describe this density, which is manifested by a certain width of track and of the interval between the tracks. In order to give an idea, in copper with a thickness of 400 &mgr;m, one can proceed with etching only class
2
, in a 35 &mgr;m thickness, class
5
, and in an 18 &mgr;m thickness, class
6
. Class
5
of etching corresponds to a track width of 150 &mgr;m and to the same width of the interval between the tracks.
As power components, reference is made here to power connectors, relays, fuses, transistors and other active protective components that are found, for example, in computers in automobiles, motor computers or cockpit computers. Although the invention originates from a problem with automobiles, it is clear that this must not be a limitation of the scope of the present application.
Besides power circuits, generally etched in class
2
or
3
, their command and control circuits, in which low currents circulate, with generally numerical signals supports, are found along the bus of multiplex data, for example. The etching of circuits of numerical data is generally done at least in class
5
.
The assembly of a power printed circuit board and of a numerical data printed circuit board, for example, but not exclusively, is in an on-board computer, brings about some difficulties: placement of the connecting bar, problem of electromagnetic compatibility, problem of bulkiness, etc.
The aim of the present application is to propose a solution that avoids these difficulties.
BRIEF SUMMARY
For this purpose, an assembly of power circuits and numerical data circuits is provided in which all the circuits are printed on a plurality of layers of different thicknesses, forming a common multilayer board. The multilayer board comprises an external numerical data layer with an external face into which all the components are incorporated.
With the aid of the invention, and in addition, the surface of the conductor is optimized and the manufacture is simplified considerably with methods of supercooling and ripple welding.
It should be pointed out that the components of the internal layers are connected there in the classical manner through blind vias.
In the multilayer board of the invention, external circuit layers of numerical data can be provided surrounding at least two internal power circuit layers.


REFERENCES:
patent: 4944684 (1990-07-01), Leibowitz
patent: 5375039 (1994-12-01), Wiesa
patent: 5384683 (1995-01-01), Tsunoda
patent: 5394301 (1995-02-01), Fassel et al.
patent: 5488540 (1996-01-01), Hatta
patent: 5801925 (1998-09-01), Boada Fonts
patent: 6201696 (2001-03-01), Shimizu et al.
patent: 6222732 (2001-04-01), Jakob et al.
patent: 6232562 (2001-05-01), Kikuchi et al.
patent: 6252179 (2001-06-01), Lauffer et al.
patent: 6335866 (2002-01-01), Ohtaki et al.
patent: 6344973 (2002-02-01), Feustel et al.
patent: 6402530 (2002-06-01), Saito et al.
patent: 6437986 (2002-08-01), Koshiba
patent: 6445592 (2002-09-01), Schirmer
patent: 6489570 (2002-12-01), Cheng
patent: 6515222 (2003-02-01), Underwood et al.
patent: 0 430 157 (1991-06-01), None

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