Optical: systems and elements – Lens – With support
Patent
1999-08-12
2000-11-21
Epps, Georgia
Optical: systems and elements
Lens
With support
438 27, 438 29, 358 14, G02B 702
Patent
active
061511730
DESCRIPTION:
BRIEF SUMMARY
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to an optically aligned optical component assembly and manufacturing process for said assembly.
The invention has applications in the field of microelectronics and is particularly used to produce optoelectronic modules that are used, for example, in optical gyrometers and multiplexers.
2. Description of the Background
In the field of microelectronics, the following aspects are required in order to increase the operating frequency of the electronic systems: parallel use of electrical buses for transmitting several signals simultaneously, and/or: optics) in order to increase the information output rate.
These optical waveguides provide a high resistance level to electromagnetic disturbances.
In the field of microsystems, the recent development of microtechnologies has led to applications of sensors or optical components in the field of integrated optics.
Apparatuses such as gyrometers, vibration sensors, chemical sensors, optical read heads and microswitches have recently been developed.
As for optoelectronic apparatuses intended for electronic systems, they need to be associated with several kinds of components such as optical components (waveguides, diffraction networks etc.), optoelectronic components (laser diodes, photodetectors etc.) and electronic components (integrated circuits made of silicon or AsGa etc.).
Optical transmission requires emission modules, receiving modules and luminous signal processing modules.
In order to achieve optical transmission, techniques have been developed using glass or silicon to ensure the following:
Optically aligned optical component assemblies are already known from the following documents to which reference may be made: module utilizing planar-processed optical waveguides and flip-chip, solder bump technology", Journal of lightwave technology, vol. 12, No. 7, July 1994, p. 1185 to 1191. integrated optical devices with optical fibre and electrical interfaces", report of ECOC 89, ThA19-7, p.368 to 371. solder bump that eliminate chip positioning adjustments", IEEE Transactions on components, hybrids and manufacturing technology, vol. 15, No. 2, April 1992, p. 225 to 230. diode with glass waveguide on Si substrate", IEEE Photonics technology letters, vol. 4, No. 1, January 1992, P. 21 to 23.
These known assemblies generally constitute a substrate on which: optical waveguides, components.
The optical and optoelectronic components must be perfectly aligned in relation to one another to minimize optical loss.
Measurements to an accuracy of within 0.5 .mu.m can be achieved.
Different processes are used in order to achieve perfect alignment.
An active alignment process is known, the aim of which is to check the alignment performance in real time using an electrical measurement on a photodiode of an optoelectronic component placed in front of a waveguide.
In order for this to be achieved, the optoelectronic component is powered and a measurement of the luminous intensity at the output of said optoelectronic component indicates the relative alignment between the various components.
The alignment is optimized due to the restricted displacements of the part to be aligned using mechanical or piezoelectric micro-control switches.
The alignment may then be held in place using bonding.
This active alignment process has a number of drawbacks: using bonding, after it has been aligned, and difficulties that could modify the alignment.
A passive alignment process is also known, the main aim of which is to reduce costs.
At present this alignment can be effected using the following: positioned on a support to an accuracy of within 0.8 .mu.m, assembled (see documents 1 to 4).
These systems are preferably assembled as follows: blocks and contact strips) of the optoelectronic component on the optical component.
This passive alignment process has the following drawbacks: positioning blocks in both the optical component and the optoelectronic component, and very long due to the high level of accuracy that is
REFERENCES:
patent: 5279711 (1994-01-01), Frankley et al.
patent: 5534442 (1996-07-01), Parker et al.
patent: 5785234 (1998-07-01), Weiss et al.
K.P. Jackson, et al., Journal of Lightwave Technology, vol. 12, No. 7, PPS. 1185-1191, "A High-Density, Four-Channel, OEIC Transceiver Module Utilizing Planar-Processed Optical Waveguides and Flip-Chip, Solder-Bump Technology", Jul. 1994.
M.J. Wale, et al., Report of ECOC 89, ThA19-7, pp. 368-371, "A New Self-Aligned Technique for the Assembly of Integrated Optical Devices with Optical Fibre and Electrical Interfaces".
M. Yanagisawa, et al., IEEE Photonics Technology Letters, vol. 4, No. 1, pp. 21-23, "Film-Level Hybrid Integration of AlGaAs Laser Diode with Glass Waveguide on Si Substrate", Jan. 1992.
Marion Fran.cedilla.ois
Massit Claude
Mottier Patrick
Commissariat a l''Energie Atomique
Epps Georgia
Thompson Timothy
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