Assembly of microwave integrated circuits having a structurally

Details Assembly of microwave integrated circuits having a structurally Assembly of microwave integrated circuits having a structurally

1977-11-28

1980-01-15

Gensler, Paul L.

Wave transmission lines and networks

Long lines

Strip type

156 64, 156298, 156329, 264261, 333246, H01P 308

Patent

active

041841336

ABSTRACT:
One or more MIC's (microwave integrated circuits) are included in an assembly having a structurally continuous ground plane of conductive material for the microwave circuitry. Individual MIC's are mounted on a carrier and attached thereto by a layer of a dielectric adhesive. The adhesive is in contact with and interposed between the lower side of each MIC substrate and the carrier which may be, for example, a metal chassis. The carrier serves as, or includes, the structurally continuous ground plane of conductive material. Ground plane metallization on the lower side of MIC substrates is thereby made unnecessary. The dielectric adhesive may be maintained in a liquid or tacky state to permit convenient removal from the assembly of an MIC requiring rework or replacement. In addition, the layer of dielectric adhesive provides a thermally conductive path between an MIC and the carrier making the invention particularly well suited for MIC assemblies which are intended to be operated in a vacuum.

REFERENCES:
patent: 3840828 (1974-10-01), Linn et al.
patent: 3843764 (1974-10-01), Grawey et al.
patent: 3982271 (1976-09-01), Olivieri et al.
patent: 4070224 (1978-01-01), Zemlin et al.

Affiliated with

Also associated with

Rating

Assembly of microwave integrated circuits having a structurally does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Assembly of microwave integrated circuits having a structurally , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Assembly of microwave integrated circuits having a structurally will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1030076