Assembly of microencapsulated electronic displays

Details Assembly of microencapsulated electronic displays Assembly of microencapsulated electronic displays

1999-12-14

2001-11-06

Ramsey, Kenneth J. (Department: 2879)

Electric lamp or space discharge component or device manufacturi

Process

With assembly or disassembly

C313S506000

Reexamination Certificate

active

06312304

ABSTRACT:

FIELD OF THE INVENTION
This invention generally relates to methods of manufacturing an electronic display, and more particularly, to methods of assembling electronic displays.
BACKGROUND OF THE INVENTION
An electronic display includes optical components such as liquid crystals and electrophoretic particles and electronic components such as electrodes and driving circuitry. The optical components and the electronic components have differing performance criteria. For example, it is desirable for the optical components to optimize reflectivity, contrast ratio and response time, while it is desirable for the electronic components to optimize conductivity, voltage-current relationship, and capacitance, or to possess memory, logic, or other higher-order electronic device capabilities. Therefore, a process for manufacturing an optical component may not be ideal for manufacturing an electronic component, and vice versa. For example, a process for manufacturing an electronic component can involve processing under high temperatures. The processing temperature can be in the range from about 300° C. to about 600° C. Subjecting many optical components to such high temperatures, however, can be harmful to the optical components by degrading the elements (i.e., the electrophoretic particles or liquid crystals) chemically or by causing mechanical damage.
SUMMARY OF THE INVENTION
One way to circumvent this problem is to change the chronology of display fabrication, in which the electronic components requiring high temperature processing are processed first, and the optical components requiring low temperature processing are processed second. Another way to circumvent this problem is to process the optical components and the electrical components separately and then integrate the two components, afterwards.
The present invention relates to a method of manufacturing an electro-optical device. In one aspect, the electro-optical device is manufactured in accordance with the following steps. First, a modulating layer, a pixel layer, and a circuit layer are provided. The modulating layer includes a first substrate and an electro-optical material provided adjacent the first substrate. The modulating layer is capable of changing a visual state upon application of an electric field. The pixel layer comprises a second substrate. A plurality of pixel electrodes are provided on a front surface of the second substrate and a plurality of contact pads are provided on a rear surface of the second substrate. Each pixel electrode is connected to a contact pad through a via extending through the second substrate. The circuit layer includes a third substrate and at least one circuit element. The modulating layer, the pixel layer, and the circuit layer are integrated to form the electro-optical device.
In one embodiment, the pixel layer and the modulating layer are integrated first to form a subassembly, and thereafter, the circuit layer and the subassembly are integrated to form the electro-optical device. For example, the pixel layer and the modulating layer can be integrated through encapsulation. Alternatively, an edge of the pixel layer and an edge of the modulating layer can be sealed together. The circuit layer and the subassembly can be integrated by bonding the two layers. For example, the circuit layer and the subassembly can be bonded by inserting an adhesive layer comprising an anisotropically conductive material between the two layers.
In another embodiment, the pixel layer and the circuit layer are integrated first to form a subassembly and thereafter, the modulating layer and the subassembly are integrated to form the electro-optical device.
In one embodiment, the electro-optical material comprises a plurality of capsules, each capsule comprising a plurality of particles dispersed in a fluid. For example, the plurality of particles can be electrophoretic particles. In another embodiment, the electro-optical material comprises liquid crystals. In still another embodiment, the electro-optical material comprises a plurality of capsules, each capsule comprising a bichromal sphere dispersed in a fluid.
In one embodiment, the modulating layer comprises a flexible substrate. For example, the modulating layer can be an organic substrate.
In one embodiment, the pixel layer comprises an insulative substrate. The pixel layer can be formed by printing or evaporating a conductive material on the front surface of the substrate to form the pixel electrodes.
In one embodiment, the circuit layer includes one or more of the following elements: a data line driver, a select line driver, a power supply, a sensor, a logic element, a memory device and a communication device. For example, the circuit layer can include non-linear devices such as transistors. The transistors can be made by printing organic-based field effect transistors on a front surface of the circuit layer.
In one embodiment, the modulating layer, the pixel layer, and the circuit layer are tested prior to being integrated.
In another aspect, the invention features an electro-optical device manufactured using the methods described herein. The electro-optical device can be an electronic display.


REFERENCES:
patent: 3036388 (1962-10-01), Tate
patent: 3384488 (1968-05-01), Tulagin et al.
patent: 3612758 (1971-10-01), Evans et al.
patent: 3670323 (1972-06-01), Sobel et al.
patent: 3767392 (1973-10-01), Ota
patent: 3792308 (1974-02-01), Ota
patent: 3806893 (1974-04-01), Ohnishi et al.
patent: 3850627 (1974-11-01), Wells et al.
patent: 3972040 (1976-07-01), Hilsum et al.
patent: 4041481 (1977-08-01), Sato
patent: 4045327 (1977-08-01), Noma et al.
patent: 4068927 (1978-01-01), White
patent: 4071430 (1978-01-01), Liebert
patent: 4088395 (1978-05-01), Giglia
patent: 4123346 (1978-10-01), Ploix
patent: 4149149 (1979-04-01), Miki et al.
patent: 4203106 (1980-05-01), Dalisa et al.
patent: 4218302 (1980-08-01), Dalisa et al.
patent: 4261653 (1981-04-01), Goodrich
patent: 4298448 (1981-11-01), Müller et al.
patent: 4305807 (1981-12-01), Somlyody
patent: 4311361 (1982-01-01), Somlyody
patent: 4324456 (1982-04-01), Dalisa
patent: 4390403 (1983-06-01), Batchelder
patent: 4418346 (1983-11-01), Batchelder
patent: 4430648 (1984-02-01), Togashi et al.
patent: 4439507 (1984-03-01), Pan et al.
patent: 4450440 (1984-05-01), White
patent: 4522472 (1985-06-01), Liebert et al.
patent: 4598960 (1986-07-01), DiSanto et al.
patent: 4643528 (1987-02-01), Bell, Jr.
patent: 4648956 (1987-03-01), Marshall et al.
patent: 4655897 (1987-04-01), DiSanto et al.
patent: 4732830 (1988-03-01), DiSanto et al.
patent: 4741604 (1988-05-01), Kornfeld
patent: 4742345 (1988-05-01), DiSanto et al.
patent: 4746917 (1988-05-01), Di Santo et al.
patent: 4833464 (1989-05-01), Di Santo et al.
patent: 4846931 (1989-07-01), Gmitter et al.
patent: 4850919 (1989-07-01), DiSanto et al.
patent: 4883561 (1989-11-01), Gmitter et al.
patent: 4892607 (1990-01-01), DiSanto et al.
patent: 4931019 (1990-06-01), Park
patent: 4947159 (1990-08-01), Di Santo et al.
patent: 5009490 (1991-04-01), Kouno et al.
patent: 5028841 (1991-07-01), DiSanto et al.
patent: 5041824 (1991-08-01), DiSanto et al.
patent: 5053763 (1991-10-01), DiSanto et al.
patent: 5066105 (1991-11-01), Yoshimoto et al.
patent: 5066946 (1991-11-01), Disanto et al.
patent: 5070326 (1991-12-01), Yoshimoto et al.
patent: 5077157 (1991-12-01), DiSanto et al.
patent: 5105185 (1992-04-01), Nakanowatari et al.
patent: 5128226 (1992-07-01), Hung
patent: 5128785 (1992-07-01), Yoshimoto et al.
patent: 5161007 (1992-11-01), Takanashi et al.
patent: 5174882 (1992-12-01), DiSanto et al.
patent: 5177476 (1993-01-01), DiSanto et al.
patent: 5187609 (1993-02-01), DiSanto et al.
patent: 5194852 (1993-03-01), More et al.
patent: 5216416 (1993-06-01), DiSanto et al.
patent: 5220316 (1993-06-01), Kazan
patent: 5223115 (1993-06-01), DiSanto et al.
patent: 5223823 (1993-06-01), DiSanto et al.
patent: 5247290 (1993-09-01), DiSanto et al.
patent: 5250932 (1993-10-01), Yoshimoto et al.
patent: 5250938 (1993-10-01), DiSanto et al.
patent: 5254981 (1993-10-01), Disanto et al.
pa

Affiliated with

Also associated with

Rating

Assembly of microencapsulated electronic displays does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Assembly of microencapsulated electronic displays, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Assembly of microencapsulated electronic displays will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2584771