Assembly of electronic packages by vacuum lamination

Details Assembly of electronic packages by vacuum lamination Assembly of electronic packages by vacuum lamination

1991-01-22

1993-11-16

Echols, P. W.

Metal working

Method of mechanical manufacture

Electrical device making

29842, 156285, 174 524, H01R 900, B29C 6500

Patent

active

052611574

ABSTRACT:
A process for the assembly of a pin grid array electronic package by vacuum lamination is provided. A vacuum is applied to the package components at the same time the components are bonded with a dielectric sealant. The sealant flow into holes formed in the package base is improved thereby electrically isolating terminal pins which pass through the holes.

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Hinton, Pressing Flex and Rigid-Flex in a Vacuum Press, appearing in Circuit World. vol. 13, No. 2 (1987) pp. 46-47.

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