Assembly of an externally ventilated semiconductor arrangement

Details Assembly of an externally ventilated semiconductor arrangement Assembly of an externally ventilated semiconductor arrangement

1981-11-04

1984-07-10

Tolin, G. P.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

165 80B, 357 82, H05K 720

Patent

active

044596383

ABSTRACT:
A semiconductor circuit arrangement including at least one semiconductor unit provided with a base plate and semiconductor element electrically insulated against the base plate, current conductors connected to the semiconductor unit and a cooling member supporting the semiconductor unit. The arrangement includes a cooling air channel which is divided into a first zone enclosing the cooling member and a second zone enclosing the semiconductor unit and the current conductors connected thereto. A fan is connected for circulating air in the cooling channel. A baffle plate is disposed in the second zone at a distance from the cooling member and is provided with openings for passage of the current conductors. A circuit board for supporting additional circuit elements is disposed to delimit one dimension of the second zone.

REFERENCES:
patent: 4027206 (1977-05-01), Lee
patent: 4122508 (1978-10-01), Rumbaugh
Hempelt, "Gleichstrom aus dem Modul", from Elektrotechnik, vol. 58, 2/6/76, pp. 10-12.

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