Assembly of a semiconductor device and paddleless lead frame hav

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Patent

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Details

257711, 257648, 257783, 257669, 257672, H01L 2348, H01L 2350, H01L 2312

Patent

active

060911336

ABSTRACT:
A semiconductor integrated circuit device, and method of manufacturing the same, having a conventional-type lead frame with the die paddle removed. In particular, the die paddle is replaced with a section of tape that is supported by the ends of the lead fingers. The semiconductor die is attached to the tape so that it may be wire bonded to the lead fingers. The tape contains at least one slot to allow for expansion and/or contraction of the tape due to various temperatures experienced during the manufacturing process so that the tape does not wrinkle or warp to alter the position of the die.

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