Assembly of a mobile objective above an optical sensor

Details Assembly of a mobile objective above an optical sensor Assembly of a mobile objective above an optical sensor

2008-07-01

2008-07-01

Gilman, Alexander (Department: 2833)

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

Reexamination Certificate

active

11533316

ABSTRACT:
An assembly structure of a mobile objective above an optical sensor assembled on a support board includes a cover assembled on the support board with an opening facing the sensor, this cover having a conical external surface with an axis orthogonal to the support board. The structure also includes a frame having first and second elements, shiftable with respect to each other under the action of an electric motor. The first frame element has a conical internal surface capable of mating with the conical external surface of the cover to ensure its positioning and to put resilient connection blades of a fixed portion of the motor in contact with pads formed on the support board, and the second frame element supports the objective and a shiftable portion of the motor.

REFERENCES:
patent: 6392827 (2002-05-01), Ueyama et al.
patent: 6483101 (2002-11-01), Webster
patent: 7046296 (2006-05-01), Shinomiya
patent: 7088397 (2006-08-01), Hunter et al.
patent: 7190404 (2007-03-01), Shinomiya
patent: 2002/0002012 (2002-01-01), Torii

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