Assembly of a heat dissipating base and a lead frame for a...

Details Assembly of a heat dissipating base and a lead frame for a... Assembly of a heat dissipating base and a lead frame for a...

2011-04-05

2011-04-05

Bryant, Kiesha R (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Incoherent light emitter structure

With housing or contact structure

C257SE33058

Reexamination Certificate

active

07919788

ABSTRACT:
A light emitting diode packaging device includes: a heat dissipating base; a light emitting dice mounted on the heat dissipating base; a lead frame coupled electrically to the light emitting dice and having a protruding wall defining a confining space for extension of a protruding part of the heat dissipating base therethrough; at least one retaining member provided on one of the protruding part of the heat dissipating base and the protruding wall of the lead frame to retain the lead frame to the heat dissipating base; and a molding material molded on the heat dissipating base and the lead frame.

REFERENCES:
patent: 3942141 (1976-03-01), Kaffenberger
patent: 6274924 (2001-08-01), Carey et al.
patent: 7161189 (2007-01-01), Wu
patent: 7170151 (2007-01-01), Elpedes et al.
patent: 7361940 (2008-04-01), Kim et al.
patent: 2006/0180824 (2006-08-01), Kim et al.
patent: 2006/0273338 (2006-12-01), Lee et al.
patent: 2008/0149962 (2008-06-01), Kim et al.
patent: 2009/0189178 (2009-07-01), Kim et al.

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