Assembly obtained from method of temporary solder assembling of

Details Assembly obtained from method of temporary solder assembling of Assembly obtained from method of temporary solder assembling of

1986-05-02

1988-04-26

Godici, Nicholas P.

Joints and connections

Including frangible component

228215, 228118, 228264, 228191, 156289, 156247, 1563043, 403272, 413 12, F16B 508, B23K 2900

Patent

active

047400994

ABSTRACT:
A method is provided of temporary assembling by soldering of peel off plates through soldering material and a flexible junction element for a mechanical release device to release two parts temporarily fixed edgewise by peeling off the flexible element and the soldering material. There is provided on the plates and flexible junction element reserve areas without any adherence to the soldering material, and preferably at the limits of said reserved areas a recess for removing any excess of soldering material, and the melting solder material is put under load for distributing it between the plates and the flexible junction element. A so obtained assembly can be applied particularly to obtain automatic opening of containers in particular in space for spreading out solar panels.

REFERENCES:
patent: 1257502 (1918-02-01), Leighton
patent: 1451869 (1923-04-01), De Land
patent: 1954840 (1934-04-01), Young
patent: 2047686 (1936-07-01), Hodgson
patent: 2479325 (1949-08-01), De Domenico
patent: 3339008 (1967-08-01), MacArthur et al.
patent: 3747197 (1973-07-01), Riel
patent: 4394953 (1983-07-01), Sonnweber et al.
patent: 4426053 (1984-01-01), Chenin et al.
patent: 4428523 (1984-01-01), Snitzer et al.
patent: 4607780 (1986-08-01), Philipoussi

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