Assembly method for semiconductor die and lead frame

Details Assembly method for semiconductor die and lead frame Assembly method for semiconductor die and lead frame

2006-09-26

2006-09-26

Fischer, Justin (Department: 1733)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S245000, C156S257000, C029S827000, C029S856000, C257S669000, C257S692000, C257S787000

Reexamination Certificate

active

07112252

ABSTRACT:
A LOC die assembly is disclosed including a die dielectrically adhered to the underside of a lead frame. The lead frame has stress relief slots formed in the undersides of the lead elements proximate the adhesive to accommodate filler particles lodged between the leads and the active surface of the die during transfer molding of a plastic encapsulant. The increased space created by the slots and flexure in the leads about the slots reduces point stresses on the active surface of the die by the filler particles. The increased flexure in the leads about the slots further enhances the locking of the leads in position with respect to the die.

REFERENCES:
patent: 3750277 (1973-08-01), Happ
patent: 4209355 (1980-06-01), Burns
patent: 4862245 (1989-08-01), Pashby et al.
patent: 4984059 (1991-01-01), Kubota et al.
patent: 5068712 (1991-11-01), Murakami et al.
patent: 5126820 (1992-06-01), Brown
patent: 5184208 (1993-02-01), Sakuta et al.
patent: 5227661 (1993-07-01), Heinen
patent: 5231303 (1993-07-01), Kasahara et al.
patent: 5233220 (1993-08-01), Lamson et al.
patent: 5252853 (1993-10-01), Michii
patent: 5286679 (1994-02-01), Farnworth et al.
patent: 5304842 (1994-04-01), Farnworth et al.
patent: 5381037 (1995-01-01), Olivarez
patent: 5384487 (1995-01-01), Rostoker et al.
patent: 5406028 (1995-04-01), Beng et al.
patent: 5418189 (1995-05-01), Heinen
patent: 5461255 (1995-10-01), Chan et al.
patent: 5466888 (1995-11-01), Beng et al.
patent: 5531860 (1996-07-01), Li
patent: 5545921 (1996-08-01), Conru et al.
patent: 5605863 (1997-02-01), Wills et al.
patent: 5733800 (1998-03-01), Moden
patent: 6277225 (2001-08-01), Kinsman et al.
patent: 6396131 (2002-05-01), Kinsman et al.
patent: 6610162 (2003-08-01), Kinsman et al.
patent: 6635954 (2003-10-01), Kinsman et al.

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