Assembly lead frame with common lead arrangement for semiconduct

Details Assembly lead frame with common lead arrangement for semiconduct Assembly lead frame with common lead arrangement for semiconduct

1993-01-21

1994-05-03

Mintel, William

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257676, 257706, H01L 2348, H01L 2946, H01L 2962, H01L 2964

Patent

active

053090179

ABSTRACT:
A lead frame for facilitating assembly and interconnection of a plurality of integrated circuit chips comprises a pattern of planar conductors including a surrounding outer connecting strip to which other conductors are temporarily joined, said outer connecting strip having an open end and a closed end. The other conductors comprise a plurality of chip mount conductive areas, each for mounting one of a plurality of chips, disposed in a fan-like arrangement adjacent to the closed end of said outer connecting strip and each connected to said outer connecting strip by a respective tie bar. The other conductors further comprise a plurality of common leads disposed in a semicircular pattern within the fan-like arrangement of the conductive areas, each adapted for connection to selected electrodes of said plurality of chips and a first plurality of parallel external leads drawn out from said common leads arranged in a row, all of said external leads being temporarily connected together and to said outer connecting strip by a common tie bar extending across the open end of said outer connecting strip.

REFERENCES:
patent: 4307297 (1981-12-01), Groffe et al.
patent: 4446375 (1984-05-01), Aird
patent: 5041902 (1991-08-01), McShane
patent: 5126823 (1990-06-01), Otsuka et al.
patent: 5200806 (1993-04-01), Sawaya

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