Assembly including fine-pitch solder bumping and method of formi

Details Assembly including fine-pitch solder bumping and method of formi Assembly including fine-pitch solder bumping and method of formi

1995-05-24

1998-08-11

Heinrich, Samuel M.

Metal fusion bonding

Process

Preplacing solid filler

22818022, H05K 334

Patent

active

057915520

ABSTRACT:
A method of solder bumping is provided which consists of: (1) applying a mask to a first substrate, (2) forming a well within the mask around a pad on the first substrate, (3) placing the solder within the well to from a depression, (4) mating a solder bump located on a second substrate with a solder depression in the well, and (5) reflowing the solder to form a pillar which interconnects the first and second substrates. Furthermore, the method may include the step of removing the mask.

REFERENCES:
patent: 4705205 (1987-11-01), Allen et al.
patent: 4712721 (1987-12-01), Noel et al.
patent: 4788767 (1988-12-01), Desai et al.
patent: 4842184 (1989-06-01), Miller, Jr.
patent: 5129573 (1992-07-01), Duffey
patent: 5299730 (1994-04-01), Pasch et al.
patent: 5439164 (1995-08-01), Hasegawa et al.
patent: 5492266 (1996-02-01), Hoebener et al.

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