Assembly formed from conductive paste and insulating paste

Details Assembly formed from conductive paste and insulating paste Assembly formed from conductive paste and insulating paste

1994-06-06

1996-03-05

McGinty, Douglas J.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

252512, 252513, 252514, 252518, 252519, 257700, 428901, 428469, 428432, 428433, 428434, 428427, 428428, 174137B, 174257, 501 19, 501 20, B32B 1504, B32B 1706, H01L 214763, H01B 116

Patent

active

054966191

ABSTRACT:
Conductive paste for via connection of a multilayer ceramic substrate, comprising: an inorganic component which consists of 30.0 to 70.0% by weight of powder of conductive material and the remainder being one of glass powder having a softening point higher than a starting point of sintering of insulating material and crystalline glass ceramic powder having a glass transition point higher than the starting point of sintering of the insulating material; and an organics vehicle component which consists of at least organic binder and solvent.

REFERENCES:
patent: 3640738 (1972-02-01), Detweiler et al.
patent: 4234367 (1980-11-01), Herron et al.
patent: 4301324 (1981-11-01), Kumar et al.
patent: 4419279 (1983-12-01), Abrams
patent: 4424251 (1984-01-01), Sugishita et al.
patent: 4464420 (1984-08-01), Taguchi et al.
patent: 4490429 (1984-12-01), Tosaki et al.
patent: 4598167 (1986-07-01), Ushifusa et al.
patent: 4699888 (1987-10-01), Dumesnil et al.
patent: 4714570 (1987-12-01), Nakatani et al.
patent: 4732798 (1988-03-01), Ishida et al.
patent: 4810528 (1989-03-01), Kondo et al.
patent: 4874550 (1989-10-01), Prabhu et al.
patent: 4877555 (1989-10-01), Yuhaku et al.
patent: 4894184 (1990-01-01), Fukuoka et al.
patent: 4904415 (1990-02-01), Lau
patent: 5118643 (1992-06-01), Jean et al.
patent: 5270268 (1993-12-01), Jean et al.
patent: 5283104 (1994-02-01), Aoude et al.
patent: 5336301 (1994-08-01), Tani et al.

Affiliated with

Also associated with

Rating

Assembly formed from conductive paste and insulating paste does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Assembly formed from conductive paste and insulating paste, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Assembly formed from conductive paste and insulating paste will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1411671