Assembly for writing and/or erasing high density data on a...

Details Assembly for writing and/or erasing high density data on a... Assembly for writing and/or erasing high density data on a...

2005-07-19

2005-07-19

Neyzari, Ali (Department: 2655)

Dynamic information storage or retrieval

Storage or retrieval by simultaneous application of diverse...

Magnetic field and light beam

C369S126000, C369S047100

Reexamination Certificate

active

06920088

ABSTRACT:
The invention discloses an assembly capable of writing/erasing high-density data, preferably on a phase-change recording media. A preferred embodiment of the invention features a novel thermal near-field heater that may be employed in the assembly, preferably for writing in a substantially thermal near-field mode. The invention provides advantages of writing densities greater than that of diffraction limited systems, for example, writing densities of approximately greater than 100 Gbit/inch2, and writing speeds approximately greater than 100 MHz.

REFERENCES:
patent: 6069853 (2000-05-01), Novotny et al.
patent: 6233206 (2001-05-01), Hamann et al.
patent: 6304527 (2001-10-01), Ito et al.
patent: 6433310 (2002-08-01), Wickramasinghe et al.
patent: 6510120 (2003-01-01), Wickramasinghe et al.
patent: 6532125 (2003-03-01), Hamann et al.
patent: 6597639 (2003-07-01), Hamann et al.
patent: 6702186 (2004-03-01), Hamann et al.
patent: 6771445 (2004-08-01), Hamann et al.

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