Assembly for transferring heat from heat generating components t

Details Assembly for transferring heat from heat generating components t Assembly for transferring heat from heat generating components t

1994-04-05

1995-10-03

Tolin, Gerald P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

165 803, 361796, H05K 720

Patent

active

054557399

ABSTRACT:
An assembly transfers heat from the heat generating components of a circuit board to a surrounding housing. A removable heat transferring member is inserted into the interior of the housing. The removable heat transferring member is thermally coupled to the heat generating components, physically coupled to the circuit board, and thermally coupled to the housing. The coupling between the removable heat transferring member and the housing is such that the member, and thus the heat generating components and circuit board, can be easily removed from and reinserted into the housing. A portion of the housing is configured as a heat sink to dissipate heat.

REFERENCES:
patent: 3634732 (1972-01-01), Finger
patent: 4027206 (1977-05-01), Lee
patent: 4203147 (1980-05-01), Gabr
patent: 4441140 (1984-04-01), Richard
patent: 4498119 (1985-02-01), Cronin
patent: 4546407 (1985-10-01), Benemati
patent: 5243493 (1993-09-01), Jeng

Affiliated with

Also associated with

Rating

Assembly for transferring heat from heat generating components t does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Assembly for transferring heat from heat generating components t, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Assembly for transferring heat from heat generating components t will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1081407