Assembly for testing silicon wafers which have a through-via

Details Assembly for testing silicon wafers which have a through-via Assembly for testing silicon wafers which have a through-via

2005-02-01

2005-02-01

Tang, Minh N. (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S1540PB

Reexamination Certificate

active

06850084

ABSTRACT:
A method for filling a via formed through a silicon wafer is disclosed. The method entails mounting the silicon wafer on a mounting substrate and depositing either molten or solid balls of a conductive material into the via. The deposited conductive material may be reflowed to provide electrical contact with other components on the surface of wafer.

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